Non contact thickness measurement can be used to measure thin wafers after backside grinding and etching, as well as wafers with patterns or protrusions adhered to blue films or other carriers. It can be applied to stacked chips and microelectromechanical systems.

Advantages:
The FSM413 echo probe sensor uses infrared (IR) interferometry technology to directly measure changes in wafer substrate thickness and overall thickness from thick to thin. Configuring a single probe system can measure materials that are transparent to infrared radiation, such as Si, GaAs, InP, SiC, glass, quartz, and some polymers. It can also measure the thickness of substrates with conventional patterns, tapes, protrusions, or bonded wafers on carriers. When configuring a dual probe system, it also provides measurement of the overall thickness of the wafer (including substrate thickness and graphic height thickness in situations where light cannot penetrate). The optional function can measure the depth of grooves and through holes (including high aspect ratio grooves and through holes in microelectromechanical systems). In addition, thin film thickness measurement and bump height measurement can also be optionally used in microelectromechanical applications.

Based on FSM Echorobe infrared interferometry technology, provide non-contact chip thickness and depth measurement methods.

Echorobe technology uses infrared beams to detect wafers.
Echoprobe can be used to measure polycrystalline silicon, sapphire, and other composite semiconductors such as GaAs, InP, GaP, GaN, etc.
Directly measure the cutting surface of the wafer graphic substrate.

Industry applications:

Mainly used in controlling the thickness of grinding chips, packaging of chip back-end, TSV (through silicon via technology), MEMS (microelectromechanical systems), sidewall angle measurement, etc.
For the LED industry, it can be used to detect the thickness and TTV of sapphire or silicon carbide wafers

Other applications:
· Groove depth measurement
· surface roughness measurement
· Thin film thickness measurement
· Epoxy thickness measurement

Echoprobe ™ Echo probe technology can provide direct measurement of the substrate thickness of thin wafers (<100um) or thin substrates on bonding structures.