JV-QC3 High resolution X-ray diffractometer

High precision technical indicators, fast automation product quality control

Specially designed for the determination of structural parameters and production quality control of semiconductor materials

Product Introduction

JV-QC3 is a new semiconductor production quality control equipment launched by Brook Semiconductor Division. It is a high-resolution X-ray diffractometer designed specifically for the compound semiconductor industry for production quality control.

Brook Technology's semiconductor department has been developing quality control (QC) equipment for over thirty years. The Bede QC200 model, as the predecessor of the QC3 model, has been widely used worldwide for testing and production control of Si, GaAs, InP, GaN, and other related semiconductor substrates or epitaxial layer materials.

Product Features

Partial or complete automation of high-resolution X-ray diffraction testing technology has been achieved, and specialized automation control programs and quality control parameters can be customized according to the specific needs of customer products.

Automated robotic arms can be configured according to customer requirements to achieve automated loading of semiconductor wafers and fully automate the testing process on the production line.

Multiple wafers can be placed simultaneously, and a single automated program can complete all wafer testing. For example, for wafers with a diameter of 100 mm, 4 or more wafers can be placed on the sample tray at the same time. The control software can sequentially execute the testing program menu for all the wafers on the sample disk, thereby reducing manual operation time and improving testing efficiency.

Product advantages

Focusing on high-resolution X-ray diffraction of semiconductor materials, without compromising resolution requirements to accommodate other X-ray testing techniques.

Compared with the previous generation of quality control equipment, the intensity of X-rays has been increased. Under the same testing speed, the testing accuracy is higher; Under the same testing accuracy conditions, the testing speed is faster.

Reduced the purchase and maintenance costs of equipment and accessories.

● Lower operating costs.

The "XRG Protect" technology can effectively extend the service life of X-ray tubes.

Environmentally friendly green working mode effectively reduces energy consumption during standby.

Provide a robotic arm for automated wafer transfer, with the ability to test multiple batches simultaneously, providing production testing efficiency.

Easy to operate, no need for professional personnel to operate.

Chip alignment, data acquisition, and analysis are fully automated.

Automated data fitting and analysis software.

● Can enable customers to remotely control data collection and result reporting on the production line

Technical application

Direct testingmeasureAnd determine morestoreyEpitaxy of epitaxial film structurestoreyComposition and relaxationDegree and strain

automaticCollimate wafer, automated testing, automated data analysis, and automated output of test results

Automated diffraction data fitting analysis using Bruker JV RADS software (i.e. Bede RADS)

X-ray diffraction of compound semiconductor materials with symmetric geometry, asymmetric geometry, and tilted symmetric geometry can be achieved

For more data instances or detailed parameters, please feel free to contact our company for request.