KSA MOS Film Stress Measurement System, also known as Thin Film Stress Gauge or Thin Film Stress Meter!
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Adopting non-contact MOS laser technology; Not only can it accurately perform statistical analysis on the stress distribution on the sample surface, but it can also perform two-dimensional stress and curvature imaging analysis on the sample surface; And this design always ensures that all laser spots in the array move or scan at the same frequency, effectively avoiding the influence of external vibrations on the test results; At the same time, it greatly improves the resolution of testing; Suitable for stress analysis of various materials and thicknesses of thin films;
Typical users: Harvard University 2 sets, Stanford University, Johns Hopkins University, Brown University 2 sets, Karlsruhe Research Center,Max Planck Institute, Xi'an Jiaotong University, China Institute of Metrology, semiconductor and microelectronics manufacturers (such as IBM.,Seagate Research Center,Phillips Semiconductor,NEC,Nissan ARC,Nichia Glass Corporation) Wait;
Related products:
*Real time in-situ thin film stress meter(kSA MOS Film Stress Tester):Using multi beam MOS technology, it can be installed on various vacuum deposition equipment (such as MBE, MOCVD, sputtering, PLD, PECVD, and annealing chambers ect) to perform real-time in-situ measurement and two-dimensional imaging analysis of stress changes during thin film growth;
*Thin film thermal stress measurement system(kSA MOS Thermal-Scan Film Stress Tester)
Technical parameters:
kSA MOS Film Stress Tester, kSA MOS Film Stress Measurement System,kSA MOS Film Stress Mapping System;
1. XY bidirectional program control scanning platform scanning range: 300mm (XY) (optional);
2. XY bidirectional scanning speed: maximum 20mm/s;
3. XY bidirectional scanning platform scanning minimum step/resolution: 2 μ m;
4.sampleholderCompatibility:50mm, 75mm, 100mm, 150mm, 200mm, and 300mmDiameter sample;
5.Programmable control scanning modes: selected area, multi-point linear scanning, full area scanning;
6.Imaging function: Sample surface2DCurvature, stress imaging, and3DImaging analysis;
7.Measurement functions: curvature, curvature radius, stress intensity, stressBowAnd warping, etc;
Main features:
1. Programmed control scanning modes: single point scanning, selected area scanning, multi-point linear scanning, full area scanning;
2. Imaging function: 2D curvature imaging of sample surface, quantitative film stress 2D imaging analysis;
3. Measurement function: film stress, warping, curvature radius, etc;
4. Support variable temperature thermal stress measurement function,Temperature range -65C to 1000C;
5. Measurement of residual stress in thin films;
Practical application: