detailed description:

Coating stress measurement system（kSA MOS Coating Stress tester）Adopting non-contact MOS laser technology; Not only can it accurately perform statistical analysis on the stress distribution on the sample surface, but it can also perform two-dimensional stress and curvature imaging analysis on the sample surface; And this design always ensures that all laser spots in the array move or scan at the same frequency, effectively avoiding the influence of external vibrations on the test results; At the same time, it greatly improves the resolution of testing; Suitable for stress analysis of various materials and thicknesses of thin films;
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Typical users: Harvard University 2 sets, Stanford University, Johns Hopkins University, Brown University 2 sets, Karlsruhe Research Center,Max Planck Institute， Xi'an Jiaotong University, China Institute of Metrology, semiconductor and microelectronics manufacturers (such as IBM.，Seagate Research Center,Phillips Semiconductor,NEC，Nissan ARC,Nichia Glass Corporation） Wait;

Related products:
*Real time in-situ thin film stress meter（kSA MOS Film Stress Tester）：Using multi beam MOS technology, it can be installed on various vacuum deposition equipment (such as MBE, MOCVD, sputtering, PLD, PECVD, and annealing chambers ect) to perform real-time in-situ measurement and two-dimensional imaging analysis of stress changes during thin film growth;
*Thin film thermal stress measurement system（kSA MOS Thermal-Scan Film Stress Tester）

Technical parameters:
kSA MOS Film Stress Tester, kSA MOS Film Stress Measurement System，kSA MOS Film Stress Mapping System;
1. XY bidirectional program control scanning platform scanning range: 300mm (XY) (optional);
2. XY bidirectional scanning speed: maximum 20mm/s;
3. XY bidirectional scanning platform scanning minimum step/resolution: 2 μ m;
4.sampleholderCompatibility:50mm, 75mm, 100mm, 150mm, 200mm, and 300mmDiameter sample;
5.Programmable control scanning modes: selected area, multi-point linear scanning, full area scanning;
6.Imaging function: Sample surface2DCurvature, stress imaging, and3DImaging analysis;
7.Measurement functions: curvature, curvature radius, stress intensity, stressBowAnd warping, etc;

Main features:
1. Programmed control scanning modes: single point scanning, selected area scanning, multi-point linear scanning, full area scanning;
2. Imaging function: 2D curvature imaging of sample surface, quantitative film stress 2D imaging analysis;
3. Measurement function: film stress, warping, curvature radius, etc;
4. Support variable temperature thermal stress measurement function,Temperature range -65C to 1000C；
5. Measurement of residual stress in thin films;