Thermal Mechanical Analyzer is one of the fundamental measurement tools in materials science. TMA can measure various data such as very small size changes, stress-strain, creep recovery, and mechanical viscoelasticity of samples made of different materials. The measurement of expansion, contraction, and dimensional stability of materials, as well as phenomena such as delamination of composite materials such as circuit boards, electronic chip packaging, and material warping, can provide extremely important measurement information for various product designs and processes, as the material properties obtained through TMA vary with temperature.