The basic principle of spray pyrolysis technology is to prepare the precursor material containing film forming components into solution, atomize it under high pressure, spray it onto the preheated substrate, and decompose it to obtain the desired film material; The commonly used high-pressure sources are compressed air, oxygen, nitrogen, hydrogen, etc; The main process parameters of the spray pyrolysis method include solution concentration, gas flow, solution flow, droplet radius, distance between the nozzle and the substrate, gas ambient temperature, substrate temperature, etc. During the film forming process, the substrate temperature, liquid flow rate, pressure of compressed gas, distance between the nozzle and the substrate, and other parameters can be precisely controlled;

The spray pyrolysis film forming system is widely used in the preparation of various functional films in the laboratory and industrial fields, such as FTO, ITO, TiO2, SnO2, ZnO, etc. (according to the shape, size and pattern required by customers);Moreover, in the preparation of DSSC solar dye-sensitized cells using this technology, it has a complete preparation process and technical support;

Technical advantages:
(1) The drying time is short, so each multi-component fine droplet does not have time to undergo segregation during the reaction process, thus obtaining uniformly composed nanoparticles;
(2) Due to the uniform mixing of raw materials in a solution state, the composition of the synthesized compounds can be precisely controlled;
(3) It can easily dope almost any element that can be used to change the properties of the film in any proportion in the film;
(4) The deposition rate and film thickness can be controlled in a large range, and the film thickness can be easily controlled by changing the spray parameters; However, the thickness of thin films prepared by chemical methods such as sol gel is difficult to control and can only be maintained in a relatively thin range;
(5) Unlike high-energy preparation methods such as radio frequency magnetron sputtering, it does not cause substrate overheating and damage, and has low selectivity for substrate material size and surface morphology;
(6) There are many precursor options available, making it easy to control the chemical stoichiometry of the thin film. Doping is easy and can change the concentration of components in the precursor solution to prepare multilayer films or component gradient films;
(7) Being able to maintain stable dynamic parameters over a large range, it is possible to prepare dense and uniform thin films without producing marginal effects;
(8) The deposition temperature is moderate (usually 100-600), and the film prepared by spray pyrolysis method has high strength and tight bonding with the substrate;
(9) Various shapes and properties of ultrafine particles can be obtained through different process conditions. The nanoparticles produced by this method have low apparent density, large specific surface area, and good powder sintering performance;
(10) No need for high-quality and high-purity target materials, nor strict vacuum requirements, simple operation, one-time reaction completion, and continuous preparation;

Equipment classification:
1) Desktop spray pyrolysis film forming system: the maximum substrate size is 25mm × 25mm, and the maximum temperature is 600 ℃;
2) R&D spray pyrolysis film forming system: the maximum substrate size is 150mm × 150mm, and the maximum temperature is 700 ℃;
3) Production spray pyrolysis film forming system: the maximum substrate size is 300mm × 300mm, and the maximum temperature is 700 ℃;

Supporting equipment:
1) Automatic electrolyte injection machine
2) Automatic electrode stacking machine
3) UV curing machine

Accessories consumables:
FTO glass is supplied in large quantities;