Chongqing Ruibiao Electromechanical Co., Ltd
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Picosecond laser marking machine
Picosecond laser marking machine
Product details

Series Overview

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Produced by RuibiaoPicosecond laser marking machineMainly launched specifically for the microfabrication market. The entire system is based on a main oscillator power amplification structure, with the optimal seed source ensuring high reliability of the laser. The laser is easy to integrate, has low maintenance costs, and can provide high-energy laser pulses with a pulse width of less than 10 picoseconds. The optimized Burst Mode function enables pulse train editing to achieve more process options, making it an extremely cost-effective choice for high-precision and rapid processing. The current precision machining is usually aimed at micro level machining needs, such as holes and grooves, while also avoiding thermal damage to surrounding materials during the machining process. That is to say, during processing, it is not only necessary to obtain fine and clean cuts, but also to minimize thermal effects. At present, many picosecond laser marking machine technologies on the market are immature and often require high costs. At the same time, their performance cannot effectively meet the processing needs, and there is a lack of practical parameters for practical application in many production environments. Through years of technological accumulation and research, Ruibiao Company has developed the latest picosecond laser marking machine, which has almost no heat affected zone and a wide range of applications. In today's rapidly developing technology, people's processing and production have undergone significant changes,The increasingly developed high-tech is constantly injecting new impetus into current processing and manufacturing, especially in recent years with the gradual maturity of laser marking machine technology, the application of laser marking machines in current processing and production has become more in-depth,Rich and diverse processing

Craftsmanship has provided more creativity for current processing.Today, with the continuous development of laser marking machine technology,Laser marking machines are also constantly being usedMoving towards a new level,Gradually moving from nanoseconds to picoseconds and femtoseconds. The rise of picosecond laser marking technology has provided a reliable solution for the current microfabrication industry, and its unique processing characteristics are widely used in many aspects of the microfabrication industry.

Picosecond laser marking machineIt uses laser photons to directly break the bonding bonds of the target material, which is relatively a "cold" processing process, so there is almost no heat affected zone. In addition, the entire processing process is very clean, so no recast material is produced, so no further treatment is needed in the later stage. Picosecond laser marking machines and picosecond laser cutting machines are widely used in various fields of precision machining, and their unique performance characteristics add momentum to the precision machining industry.


Advantage

• Adopting a highly reliable micro seed source

• Has ultra-high peak power

• Has ultra short pulse width

Laser pulse width less than 10 picoseconds,

Sample Display


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Picosecond sapphire cutting Fingerprint recognition chip laser cutting sample Fingerprint recognition chip laser cutting sample

激光划线

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Wafer slicing FPC soft board shape cutting and drilling Chip cutting


Application industry

Picosecond laser, as a typical representative of ultra short pulse laser, has the characteristics of ultra short pulse width and ultra-high peak power. It has a wide range of processing objects, especially suitable for processing brittle materials and thermosensitive materials such as sapphire, glass, ceramics, etc. Therefore, it is suitable for application in the micro processing industry of the electronics industry. In the past two years, the demand for picosecond processing equipment has rapidly increased, mainly due to the application of fingerprint recognition modules on mobile phones since last year, which has driven the procurement of specialized equipment picosecond lasers. The fingerprint module involves laser processing steps such as: ① wafer cutting, ② chip cutting, ③ cover plate cutting, ④ FPC soft board shape cutting and drilling, ⑤ laser marking, etc. The main focus is on the processing of sapphire/glass cover plates and IC chips. Since 2015, Apple 6 has officially adopted fingerprint recognition, which has driven the popularity of a group of domestic brands. Currently, the penetration rate of fingerprint recognition is less than 50%, so there is still a lot of room for development in picosecond machines used for processing fingerprint recognition modules. At the same time, picosecond machines can also be applied to PCB drilling, wafer cutting, etc., and their application fields are constantly expanding. Especially with the application of high value-added brittle materials such as sapphire and ceramics in future mobile phones, picosecond laser processing equipment will become an important component of 3C automation equipment. We believe that picosecond lasers may play a broad and profound role in the field of 3C automated processing equipment in the future.

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