High Performance

- C/T 7 Sec, 220 BPH (W220mm PCB)

-Lightweight, high-speed Stage Aligner

High Quality

- Accuracy ±12.5um@ Cpk≥2.0(0402)

-SPI check result feedback, automatic correction of offset

Flexible Production

-Support Dual Lane production system

-Can handle PCB L510mmxW460mm

Easy Operation

- Stage Auto leveling / Auto Mask Setting

>Ensure high efficiency through Compact and lightweight StageAlignment methods

-Our company's inherent 4-point support includes Tilting Clamp method, Z-axis direct connection Up/Down Mechanism, etc., achieving optimization

>Shortened StencilMask cleaning time and improved actual productivity

-The average cleaning time for C/T ranges from 6 seconds to 4 seconds, and in actual production, it has achieved the effect of shortening T/T by 2 seconds

>Align Accuracy：± 12.5um@Cpk ≥ 2.0, actual printing accuracy: ± 25um@Cpk ≥2.0

-Even if the PCB is enlarged (L250->L510), it can maintain a repeatability accuracy of Alignment ± 12.5um @ Cpk ≥ 2.0

>Support Mask Vacuum function to achieve high-quality printing (0402/CSP Φ 0.21mm ensures separation)

-If Mask Vacuum is used to print Fine Size chips such as microchips, a vacuum is generated at the bottom of the PCB and a vacuum state is formed between the M/Mask and the PCB. During the board separation action, the Solder Paste at the micro opening can be directly removed according to its shape using the pressure difference between the upper and lower surfaces of the M/Mask (Cp ≥ 2.0)