H-22 Epo-Tek^®Conductive silver adhesive, conductive silver epoxy resin paste

Mixing ratio: Silver Tree Fat Cream /Liquid hardener: 100：4.5；

100% Solid, two-component silver epoxy paste, with soft, smooth, and thixotropic properties (viscosity can be reduced when stirred or shaken), making it particularly suitable for chip bonding in microelectronics and optoelectronics applications. It has good processing performance and a long lifespan at room temperature. Suitable for applications that require rapid curing, such as fast circuit repair, screen printing, etc., capable of withstanding temperatures up to400°C.

Curing time (Minimum bonding temperature/time)
150°C ......... five minute
120°C ....... tenminute
100°C ....... twentyminute
80°C ....... forty-fiveminute

characteristic:

• resistivity 2 ohms/sq/mil

• cold storage: unwanted

• high viscosity20，000cps