Femtosecond taper free laser cutting machine

Basic functions of the machine

(1) Suitable for product maximum size: 10 * 10-1500 * 1250mm.

(2) Suitable for products with a maximum thickness of 3mm or less.

(3) Suitable for product accuracy: The minimum line width and diameter of the laser are 10um ± 1um.

(4) The machine adopts a high-performance 1064nm picosecond (femtosecond) laser with a laser beam quality of M2<1.3, high peak power, ultra narrow pulse width, high repetition rate, and high pulse stability. The focused spot is small, the incision is narrow, the processing speed is fast, and there is almost no heat affected zone, creating excellent processing quality;

(5) The machine laser micro machining system adopts a high rigidity structure design, a shock-absorbing machine foot cup, and a machine base composed of natural marble, which can eliminate the inertial vibration generated during the start/stop and acceleration process of the high-speed linear motor motion platform, and effectively prevent the stress deformation of the bed caused by climate change and temperature difference;

(6) The machine adopts a high-precision two-dimensional linear motor platform and a fully closed-loop grating detection control system to ensure the positioning and repeatability accuracy of the machine tool;

(7) Equipped with precision German cutting heads, suitable for high-speed marking applications with extremely high edge effect requirements;

(8) The machine is equipped with a high pixel CCD camera, which has automatic image recognition and high-precision image positioning capabilities; It can also capture Mark marks or ITO Mark marks (target: circular cross box cross plus solid circle image, etc.). It can use two-point or four point positioning, and the memory function after capturing the mark greatly saves time in capturing the target.

(9) The machine is equipped with dedicated feeding and receiving mechanisms. The entire product processing process is fully automated for feeding and unloading. If any abnormalities occur, an automatic alarm will be triggered, eliminating the need for manual intervention for loading and unloading, greatly improving work efficiency!

(10) Equipped with dust exhaust and dust collection systems to recover and remove dust generated during laser processing, ensuring that machine optical components, optical transmission systems, and production workshops are not contaminated

(11) Special control software for laser micro processing system, supporting DXF DWG format file import of graphics, automatic control of the entire process by computer software, capable of automatic feeding of feeding mechanism products, automatic target positioning by CCD, automatic scanning of vibrating mirror and processing, and automatic extraction of dust generated during the processing. The full process software automatic control operation is simple, the overall performance is stable, and it can run continuously for 24 hours for a long time

Technical specifications and parameters