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E22-900MM22S SX1262 RF chip lora module
Air speed bps: 2.4~62.5k
Product details

lora模块
lora模块
lora无线模块
lora模块
lora模块
lora模块
lora模块

Parameters performance notes
minimum value Maximum value
Power supply voltage (V) 0 3.7 Module permanently burned out beyond 3.7V
Blocking power (dBm) - 10 The probability of burning is relatively low when used at close range
Working temperature (℃) -40 85 -
Net weight 0.5g ± 0.02g Net weight


Parameters performance notes
minimum value Typical values Maximum value
Working voltage (V) 1.8 3.3 3.7 ≥ 3.3V ensures output power
Communication level (V) - 3.3 - There is a risk of burning out when using 5V TTL
Working temperature (℃) -40 - 85 Industrial grade design
Working frequency band (GHz) 850 868/915 930 Support ISM frequency band
work
consume
Emission current (mA) - 119 - Instantaneous power consumption
Receiving current (mA) - 6.8 - -
Sleep current(μA) - 185 - Software shutdown
Maximum transmission power (dBm) 21.4 21.5 22.3 -
Receiving sensitivity (dBm) -144 -146 -147 The air speed is 0.3kbps
Air speed (bps) 0.6k - 300k User programming control
0.018k -
62.5k User programming control


Main application describe notes
Reference distance 7000m Clear and open environmentAntenna gain 5dBiAntenna height of 2.5m, air speed of 0.3kbps
FIFO 256 Byte Maximum length for a single transmission
Vibration frequency 32 MHz -
Modulation Type LoRa (recommended) -
Packaging method Surface mount type -
Interface method 1.27mm Stamp hole
communication interface SPI 0-10Mbps
External dimensions 10* 10*2.5 mm -
antenna interface Stamp hole/IPEX Equivalent impedance of approximately 50 ohms


900Mlora模块引脚

Pin number Pin Name Pin direction Pin usage
1 VCC -

Power supply, range 1.8V~3.7V (it is recommended to add ceramic filter capacitors externally)

2 GND -

Ground wire, connected to the power reference ground

3 NRST input

Chip reset triggers input pin, low level is valid

4 NC
-

-

5 NC -

-

6 ANT -

RF interface, stamp hole

7 GND -

Ground wire, connected to the power reference ground

8 NC -

-

9 TXEN input

RF switch transmission control pin, connected to external microcontroller I0 or DIO2, high level effective

10 RXEN input

RF switch receiving control pin, connected to external microcontroller I0, high level effective

11 BUSY output

Used for status indication

12 MIS0 output

SPI data output pin

13 M0SI input

SPI data input pin

14 NSS input

Module chip selection pin, used to start an SPI communication

15 SCK input

SPI clock input pin

16 GND -

Ground wire, connected to the power reference ground

17 NC -

-

18 DI03 input/output

Configurable universal I0 port

19 DIO2 input/output

Configurable universal I0 port

20 DI01 input/output

Configurable universal I0 port


Product manual

Development testing



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    Packaging form

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