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Application features:

This machine is an ultra fast machine developed for cutting and shaping sapphire products in the 3C electronics manufacturing industryPicosecond laser cutting machineIt is generally used for cutting sapphire HOME keys in mobile phone products, cutting protective lenses for cameras, etc. The equipment is equipped with an ultra fast picosecond laser, which has high production and processing accuracy, small heat affected area, no burrs, chipping or residue on the edges of the product, and extremely strong stability. Multiple materials can also be subjected to precision drilling, cutting, and micro machining processes such as grooving. Double head dual axis and automatic loading and unloading device, with high degree of automation and high processing efficiency. The dual cutting head can process two 2-inch sapphires simultaneously, making it twice as efficient as single head equipment. Due to the use of a dual station structure, laser processing and automatic loading and unloading are carried out simultaneously without interference.
1. High processing accuracy, small heat affected area, and no burrs or residues on the processing edges
2 automatic loading and unloading, dual station processing, high efficiency and stable performance
3 can perform precision drilling, cutting, and groove cutting on various materials for micro machining processing
4 non-contact processing, no need to replace consumables, low cost of use

Application areas: Sapphire window cutting, fingerprint recognition glass cutting, and drilling of other brittle materials.