scope of application：Diamond grinding discs are widely used in precision grinding of wafers (semiconductor silicon wafers and solar silicon wafers), diamond composites, diamond polycrystals, diamond cutting tools, cubic boron nitride, tungsten steel (hard alloy), new engineering structural ceramics, gemstones, crystals, rare earth materials (magnetic materials), high-speed steel, bearing steel, tool steel, as well as difficult to grind materials such as stainless steel, powder metallurgy, cast iron, etc. Typical workpieces, air conditioning and refrigerator compressor slides, valve plates, automotive steering

　High flatness workpieces such as pumps, blades, rotor stator measuring blocks, and thin-walled bearings.Applicable equipment

　　This product is produced in conjunction with Hyde grinding equipment and is widely applicable to imported grinding equipment and peer grinding equipment. For more details, please consult Hyde customer service personnel.diameter

　　：380mm——610mm——810mm——910mm——1500mmaperture

　　：200mm——500mmMatrix thickness

　　：45mm——100mmGranularity:

　　50-3000 meshCBN working layer thickness

　　：5mm——15mmCBN shaped equipment

　　Cylindrical, hexagonal, fan-shapedGrinding disc accuracy

　　：parallelism

　　≤0.02mmroughness

　　0.1μm——1.2μmFlatness

　　0.001mm——0.004mm， Parallelism ≤ 0.002mm, equal height ≤ 0.002mmnotes

The diamond grinding disc can be customized according to the customer's size and thickness.