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Cover film UV laser cutting machine
The fully automatic polyimide covering film UV laser cutting machine can achieve automatic loading and unloading, automatic cutting, and fully automat
Product details
Schematic diagram of fully automatic covering film automatic loading and unloading, cutting system
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Laser wavelength: 355nm
Laser power: 12W@30KHz / 10W@50KHz
Single work format: 40 × 40mm (customizable)
Maximum width for splicing: 280mm
Product Features
Using laser cutting is convenient and fast, shortening the delivery time
Good cutting quality, minimal deformation, smooth appearance, and beautiful appearance
Integrating numerical control technology, laser technology, software technology and other optoelectronic technologies, it has high precision and high flexibility
cutting range
Flexible printed circuit boards and related auxiliary materials
Soft hard combination version, hard board marking, circuit board with soldered components, glass film, ceramic, silicon wafer.
Technical Parameter
| laser device | All solid state UV laser |
| wavelength | 355nm |
| laser power | 10W@50KHz / 12W@30KHz |
| Positioning accuracy of linear motor worktable | ±2μm |
| Repetitive accuracy of linear motor worktable | ±1μm |
| Splicing processing range | 400mm x 300mm (customizable according to customer requirements) |
| Visual positioning accuracy | ±3μm |
| Single processing format | 40mmх40mm |
| Mirror repeatability accuracy | ±1μm |
| A-axis paper winding device | Width<280mm/stepper motor paper delivery wheel |
| Z-axis adsorption platform | Step by step electric lifting 20mm Honeycomb adsorption platform |
| Cutting device | Automatic control pneumatic guillotine |
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