Product Usage:

Mainly suitable for grinding thin and brittle metal or non-metal materials such as monocrystalline silicon wafers, quartz chips, optical glass, ceramic wafers, gallium arsenide, etc.

　　Product advantages:

1. Adopting the appropriate optimal formula to meet different technical requirements for grinding workpieces. (Materials: Grey cast iron, ductile iron)

2. Design reasonable processing techniques (groove spacing, groove width, groove depth) according to different grinding requirements. Combining speed ratios to maximize the efficiency of grinding quality.

3. In order to meet the high-precision quality requirements for grinding, specialized measuring tools are designed to control the parallelism and flatness of the grinding disc, meet the needs of grinding workpieces, reduce disc repair time, and improve product quality and production efficiency.

4

According to the technical quality requirements of grinding, a scientific heat treatment process has been designed. Improve the molecular structure to ensure good stability of the grinding disc, prevent deformation during use, achieve stable product quality during production, and improve work efficiency and service life.Applicable equipment

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　　This product is produced in conjunction with Hyde grinding equipment and is widely applicable to imported grinding equipment and peer grinding equipment. For details, please consult Hyde customer service personnel.

1～2μm